Mingyu Li

发表

Highly sensitive detection of low-concentration sodium chloride solutions based on polymeric nanofilms coated long period fiber grating.

Lei Cai, Qing-ai Liu, Yan Yang, 2022, Talanta.

Interfacial microstructure characterization and solderability of the low pressure cold sprayed Cu-Al2O3 coating on Al substrate

C. Hang, Hongtao Chen, F. Wang, 2023, Surface & Coatings Technology.

Preparation, properties, and reliability of Cu/Sn composite joints with porous Cu as interlayer for high-temperature resistant packaging

C. Hang, Jiahao Liu, Hongtao Chen, 2023, Journal of Materials Science: Materials in Electronics.

Soft-template-assisted bottom-up fabrication of tunable porosity monolithic copper film for interconnection in microelectronics

Hongtao Chen, Jianqiang Wang, Zi-wen Lv, 2023, Journal of the Taiwan Institute of Chemical Engineers.

Nucleation and Growth of CuSn during the Aging Process of Cu/Sn interface in Electronic Packaging——by in-Situ TEM

Luobin Zhang, Jianqiang Wang, Zi-wen Lv, 2023, Acta Materialia.

Electrical and mechanical reliability and failure mechanism analysis of electrically conductive adhesives

Jiahao Liu, Hao Liu, Weiwei Zhang, 2023, Microelectronics Reliability.

An Innovative High-Entropy Alloy Solder for High-reliability Low-Temperature Bonding in 3D Electronic Packaging——Based on nano InSnBiZnAg particles

Hongtao Chen, Luobin Zhang, Jianqiang Wang, 2024, Journal of Materials Research and Technology.

A Study of Electroplated Nanoporous Copper Using Aberration-Corrected Transmission Electron Microscopy

Hongtao Chen, Luobin Zhang, Jianqiang Wang, 2024, Nanomaterials.

Surface treatment of micron silver flakes with coupling agents for high-performance electrically conductive adhesives

C. Hang, Jiahao Liu, Hongtao Chen, 2022, International Journal of Adhesion and Adhesives.

Effect of CoSn3 nanocrystals on Sn3Ag plating for electronic packaging

Hongtao Chen, Luobin Zhang, Jianqiang Wang, 2023, Scientific reports.