K. Lin

3D Integration of Vertical-Stacking of MoS2 and Si CMOS Featuring Embedded 2T1R Configuration Demonstrated on Full Wafers

C. Yao, C. Su, T. Hong, 2020, 2020 IEEE International Electron Devices Meeting (IEDM).

Laminated memory: a new 3-dimensional packaging technology for MCMs

Nicholas E. Brathwaite, Kirk Flatow, J. Demmin, 1994, Proceedings of IEEE Multi-Chip Module Conference (MCMC-94).

Full low temperature microwave processed Ge CMOS achieving diffusion-less junction and Ultrathin 7.5nm Ni mono-germanide

Yao-Jen Lee, C. Hu, P. Sung, 2012, 2012 International Electron Devices Meeting.