Z. H. Mai

发表

In-depth circuits edit analysis to reveal the implantation-related defect

Jeffrey Lam, C. Q. Chen, G. B. Ang, 2017, Microelectron. J..

Electrical simulation on the localized NVM failed cell by AFP nanoproing

C. Q. Chen, G. B. Ang, Z. H. Mai, 2015, 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Fault isolation on marginal failures using dummy signals

Z. H. Mai, D. Nagalingam, S. Moon, 2017, 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Application of Scanning Capacitance Microscopy on SOI device with wafer edge low yield pattern

C. Q. Chen, Francis Rivai, G. B. Ang, 2017, Microelectron. Reliab..

On-chip device and circuit diagnostics on advanced technology nodes by nanoprobing

J. Lam, T. H. Ng, Z. H. Mai, 2014, Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Static fault localization of subtle metallization defects using near infrared photon emission microscopy

Jeffrey Lam, G. B. Ang, Z. H. Mai, 2017, Microelectron. Reliab..

Top-down delayering to expose large inspection area on die side-edge with Platinum (Pt) deposition technique

Ran He, Y. Z. Zhao, B. Liu, 2015, Microelectron. Reliab..

High temperature nanoprobing application for SRAM soft failure fault isolation

Z. H. Mai, P. T. Ng, C. Q. Chen, 2017, 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Electrical analysis on implantation-related defect by nanoprobing methodology

Jeffrey Lam, C. Q. Chen, Francis Rivai, 2016, Microelectron. Reliab..

Nanoprobing on the SRAM static noise margin (SNM) soft fail analysis

C. Q. Chen, Francis Rivai, Z. H. Mai, 2016, 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Embed SRAM IDDOFF fail root cause identification by combination of device analysis and localized circuit analysis

C. Q. Chen, Francis Rivai, G. B. Ang, 2017, Microelectron. Reliab..

Application of laser deprocessing technique in PFA on chemical over-etched on bond-pad issue

L. Zhu, Ran He, Y. Z. Zhao, 2016, Microelectron. Reliab..

A Silicon Debugging Methodology on Customer Prototypes for Wafer Foundries

Z. H. Mai, Z. Mai, 2012 .

Detection of solder bump marginal contact resistance degradation using 4-point resistance measurement method

J. Lam, D. Nagalingam, G. B. Ang, 2016, 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Failure analysis methodology on donut pattern failure due to photovoltaic electrochemical effect

Jeffrey Lam, C. Q. Chen, G. B. Ang, 2017, Microelectron. Reliab..

Fault isolation on the wafer with lithography hotspot signature

C. Q. Chen, J. Lam, Francis Rivai, 2017, 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Cross-sectional nanoprobing fault isolation technique on submicron devices

L. Zhu, Ran He, Y. Z. Zhao, 2016, Microelectron. Reliab..

Failure analysis methodology for the localization of thin and ultra-thin metal barrier residue

G. B. Ang, Z. H. Mai, A. C. T. Quah, 2014, Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Failure mechanism analysis and process improvement on time-dependent dielectric breakdown of Cu/ultra-low-k dielectric based on complementary Raman and FTIR spectroscopy study

Z. H. Mai, D. D. Wang, J. Lam, 2014, 2014 IEEE International Integrated Reliability Workshop Final Report (IIRW).