K. Nishi
发表
M. Ishizuka,
S. Nakagawa,
K. Nishi,
2014,
2014 International Conference on Electronics Packaging (ICEP).
J. Ueda,
K. Nishi,
H. Kajitani,
1992,
NUPAD IV. Workshop on Numerical Modeling of Processes and Devices for Integrated Circuits,.