F. Löffler

Thermal Characterisation and Failure Analysis of MMIC Components by Thermo-Reflectance Imaging

A. Ziaei, B. Wunderle, D. May, 2020, 2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

An In-line Failure Analysis System Based on IR Thermography Ready for Production Line Integration

B. Wunderle, D. May, D. Wargulski, 2019, 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

Comparative Die-Attach Failure Analysis by Thermoreflectance, Infrared Thermography and Scanning Acoustic Microscopy

A. Ziaei, B. Wunderle, D. May, 2018, 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

Thermal Conductivity Measurements of Thermal Interface Materials Using the Bidirectional 3-Omega Method

B. Wunderle, D. May, M. A. Ras, 2022, 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).