Ji Chel Bea

Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2016, Micromachines.

Ultra shallow junction formation using excimer laser annealing for ultra small devices

Eun Sik Jung, Yong Jae Lee, Ji Chel Bea, 2001, ISIE 2001. 2001 IEEE International Symposium on Industrial Electronics Proceedings (Cat. No.01TH8570).

Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers

Mitsumasa Koyanagi, Takafumi Fukushima, K. W. Lee, 2015, 2015 International 3D Systems Integration Conference (3DIC).

Heterogeneous integration technology for MEMS-LSI multi-chip module

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2009, 2009 IEEE International Conference on 3D System Integration.

Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2009, 2009 IEEE International Conference on 3D System Integration.

Fabrication and Morphological Characterization of Nano-Scale Interconnects for 3D-Integration

Mitsumasa Koyanagi, Takafumi Fukushima, Mariappan Murugesan, 2019, 2019 International 3D Systems Integration Conference (3DIC).

Advanced 2.5D/3D hetero-integration technologies at GINTI, Tohoku University

Tetsu Tanaka, Takafumi Fukushima, K. W. Lee, 2015, 2015 International 3D Systems Integration Conference (3DIC).

Impacts of 3-D integration processes on device reliabilities in thinned DRAM chip for 3-D DRAM

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2015, 2015 IEEE International Reliability Physics Symposium.

Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV

Mitsumasa Koyanagi, Takafumi Fukushima, K. W. Lee, 2014, 2014 International 3D Systems Integration Conference (3DIC).

Intra- and inter-chip electrical interconnection formed by directed self assembly of nanocomposite containing diblock copolymer and nanometal

Takafumi Fukushima, Mariappan Murugesan, H. Hashimoto, 2018, 2018 IEEE International Reliability Physics Symposium (IRPS).

Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI

Tetsu Tanaka, S. Kimura, Takafumi Fukushima, 2014, 2014 International 3D Systems Integration Conference (3DIC).

Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2011, Micromachines.