D. Shao

Parallel Plate Cavity Mode Suppression by Miniaturized 2.5-D Electromagnetic Bandgap Structure for Low Frequency Microwave Circuit

Wenjie Feng, Yongle Wu, Yongrong Shi, 2020, IEEE Transactions on Circuits and Systems II: Express Briefs.

Silicon Interposer Package for MMIC Heterogeneous Integration Based on Gold/Solder Ball Flip-Chip Technique

W. Feng, Yongrong Shi, Junzhi Zhang, 2019, IEEE Transactions on Components, Packaging and Manufacturing Technology.