B. Moser

Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies

Alessandro Magnani, Lorenzo Codecasa, Vincenzo d'Alessandro, 2017, Microelectron. Reliab..

Accurate and efficient analysis of the upward heat flow in InGaP/GaAs HBTs through an automated FEM‐based tool and Design of Experiments

Lorenzo Codecasa, Vincenzo d'Alessandro, Peter J. Zampardi, 2018, International Journal of Numerical Modelling: Electronic Networks, Devices and Fields.

Modeling of an InGaP/GaAs BiFET VVR Device

W. Clausen, B. Moser, 2009, 2009 Annual IEEE Compound Semiconductor Integrated Circuit Symposium.

Analysis of the Influence of Layout and Technology Parameters on the Thermal Impedance of GaAs HBT/BiFET Using a Highly-Efficient Tool

V. d'Alessandro, A. Magnani, L. Codecasa, 2014, 2014 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS).

Combined SPICE-FEM analysis of electrothermal effects in InGaP/GaAs HBT devices and arrays for handset applications

Lorenzo Codecasa, Vincenzo d'Alessandro, Peter J. Zampardi, 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).