John O. Dukovic

Feature-scale simulation of resist-patterned electrodeposition

John O. Dukovic, J. Dukovic, 1993, IBM J. Res. Dev..

Damascene copper electroplating for chip interconnections

Panayotis C. Andricacos, Hariklia Deligianni, John O. Dukovic, 1998, IBM J. Res. Dev..

Proceedings of the Second International Symposium on Electrochemical Microfabrication

Madhav Datta, Keith Sheppard, John O. Dukovic, 1995 .

The Influence of Lithographic Patterning on Current Distribution in Electrodeposition: Experimental Study and Mass‐Transfer Effects

Panayotis C. Andricacos, John O. Dukovic, Lubomyr T. Romankiw, 1993 .

Simulation of Leveling in Electrodeposition

John O. Dukovic, Charles W. Tobias, J. Dukovic, 1990 .

Material, Process and Geometry Effects on Through-Silicon Via Reliability and Isolation

Sesh Ramaswami, John O. Dukovic, Aditya P. Karmarkar, 2010 .

Electrochemical Fabrication of Mechanically Robust PbSn C4 Interconnections

Madhav Datta, Ho-Ming Tong, Panayotis C. Andricacos, 1995 .

The Influence of Lithographic Patterning on Current Distribution: A Model for Microfabrication by Electrodeposition

Panayotis C. Andricacos, John O. Dukovic, Lubomyr T. Romankiw, 1992 .