Y. Ji

Reliability characterization of advanced CMOS image sensor (CIS) with 3D stack and in-pixel DTI

Hoyoung Kang, Hyun-Chul Sagong, Junekyun Park, 2018, 2018 IEEE International Reliability Physics Symposium (IRPS).

Optimal design of dummy ball array in wafer level package to improve board level thermal cycle reliability (BLR)

Jaewon Chang, Jinseok Kim, Ayoung Kim, 2018, 2018 IEEE International Reliability Physics Symposium (IRPS).