Zulkifli Mohamad Ariff

Study on the Effect of Stack Thickness During Encapsulation of Stacked-Chip Scale Packages (S-CSP)

Shahrul Kamaruddin, Mohd Zulkifly Abdullah, M. Khalil Abdullah, 2008 .

Molded underfill (MUF) encapsulation for flip-chip package: A numerical investigation

Mohd Zulkifly Abdullah, M. K. Abdullah, Mohamed A. Ismail, 2017 .

Three-dimensional numerical and experimental investigations on polymer rheology in meso-scale injection molding

M. K. Abdullah, C. Y. Khor, Mohd Zulkifly Abdullah, 2010 .

EFFECT OF FILLER TREATMENTS ON RHEOLOGICAL BEHAVIOR OF CALCIUM CARBONATE AND TALC-FILLED POLYPROPYLENE HYBRID COMPOSITES

Zulkifli Mohamad Ariff, Z. Ishak, S. S. Jikan, 2006 .