Daniel Bolowski

Reliability aspects of copper metallization and interconnect technology for power devices

Daniel Bolowski, Karina Rott, Frank Umbach, 2016, Microelectron. Reliab..

Power semiconductor module with integrated thick-film circuit board

Daniel Bolowski, Ulrich Michael Georg Schwarzer, 2011 .

Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding

Andreas Unger, Walter Sextro, Simon Althoff, 2014 .

End-of-life investigation on the .XT interconnect technology

Daniel Bolowski, Nicolas Heuck, Karsten Guth, 2015 .

Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds

Walter Sextro, Simon Althoff, Daniel Bolowski, 2014 .