Y. T. Chin

Investigation of mechanical shock testing of lead-free SAC solder joints in fine pitch BGA package

Y. T. Chin, P. K. Lam, H. K. Yow, 2008, Microelectron. Reliab..

Effect of heating profile on printed circuit boards using Shadow Moiré and simulations

Y. T. Chin, K. S. Tan, T. Tou, 2021 .

Thermomechanical studies of surface mounted microelectronics by finite element analysis

Y. T. Chin, K. S. Tan, T. Tou, 2019, Composites Part B: Engineering.

Single pulse laser removal of indium tin oxide film on glass and polyethylene terephthalate by nanosecond and femtosecond laser

Chern Yang Leong, Y. T. Chin, S. Yap, 2020, Nanotechnology Reviews.

Interfacial reactions of SAC305 and SAC405 solders on electroless Ni(P)/immersion Au and electroless Ni(B)/immersion Au finishes

Y. T. Chin, A. Ourdjini, S. Aisha, 2010, 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT).

Transmission electron microscopy studies of interfacial reactions and void formation in lead-free solders with minor elements

Y. T. Chin, T. Tou, H. Yow, 2010 .

Effect of Nickel addition into Sn-3Ag-0.5Cu on intermetallic compound formation during Soldering on copper

Y. T. Chin, A. Ourdjini, I. Aisha, 2012, International Electronics Manufacturing Technology Symposium.

Effect of Solder Volume on Interfacial Reactions between Eutectic Sn-Pb and Sn-Ag-Cu Solders and Ni(P)-Au Surface Finish

Y. T. Chin, K. S. Tan, A. Ourdjini, 2006, 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium.

Lead-free compatible underfill materials for flip chip applications

Y. T. Chin, Yi He, C. Chee, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).