文
论文分享
演练场
杂货铺
论文推荐
字
编辑器下载
登录
注册
Sting Wu
发表
Study of rapid cure BGA mold compound on warpage with shadow moire
M. Hung, J.J. Lee, J.C.L. Wu, 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).