Ninad Shahane

Nanopackaging for Component Assembly and Embedded Power in Flexible Electronics: Heterogeneous Component Integration for Flexible Systems

Rao Tummala, Chandrasekharan Nair, P. Markondeya Raj, 2018, IEEE Nanotechnology Magazine.

Enabling Chip-to-Substrate All-Cu Interconnections: Design of Engineered Bonding Interfaces for Improved Manufacturability and Low-Temperature Bonding

Antonia Antoniou, Rao Tummala, Vanessa Smet, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Low-temperature, organics-free sintering of nanoporous copper for reliable, high-temperature and high-power die-attach interconnections

Pulugurtha Markondeya Raj, Rao Tummala, Antonia Antoniou, 2017, 2017 IEEE Applied Power Electronics Conference and Exposition (APEC).