Kuo-Ning Chiang

发表

Solder joints layout design and reliability enhancements of wafer level packaging using response surface methodology

Chang-Chun Lee, Shu-Ming Chang, Chien-Chen Lee, 2007, Microelectron. Reliab..

Time and temperature-dependent mechanical behavior of underfill materials in electronic packaging application

Kuo-Ning Chiang, Chia-Tai Kuo, Ming-Chuen Yip, 2004, Microelectron. Reliab..

Light degradation test and design of thermal performance for high-power light-emitting diodes

Chang-Chun Lee, Kuo-Ning Chiang, Tuan-Yu Hung, 2012, Microelectron. Reliab..

Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration

Kuo-Ning Chiang, J. D. Wu, Kuo-Ming Chen, 2006, Microelectron. Reliab..

Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact

Kuo-Ning Chiang, Tuan-Yu Hung, Chan-Yen Chou, 2008, Microelectron. Reliab..

Fabrication process simulation and reliability improvement of high-brightness LEDs

Kuo-Ning Chiang, Chien-Fu Huang, Cheng-Nan Han, 2009, Microelectron. Reliab..

Measurement and simulation of interfacial adhesion strength between SiO2 thin film and III-V material

Kuo-Ning Chiang, Chung-Jung Wu, Cheng-Nan Han, 2011, Microelectron. Reliab..

Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn-3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip

Chih-Tang Peng, Kuo-Ning Chiang, Chia-Tai Kuo, 2006, Microelectron. Reliab..

AI-assisted reliability life prediction model for wafer-level packaging using the random forest method

Kuo-Ning Chiang, H Y Hsiao, H. Hsiao, 2020, Journal of Mechanics.

A Novel Design Structure for WLCSP With High Reliability, Low Cost, and Ease of Fabrication

Yu-Fang Chen, Shu-Ming Chang, Kuo-Ning Chiang, 2007, IEEE Transactions on Advanced Packaging.

Sensitivity Design of DL-WLCSP Using DOE With Factorial Analysis Technology

Chang-Chun Lee, Shu-Ming Chang, Kuo-Ning Chiang, 2007, IEEE Transactions on Advanced Packaging.

Impact of probing procedure on flip chip reliability

Kuo-Ning Chiang, Kuo-Ming Chen, 2003, Microelectron. Reliab..

Transient thermal analysis of high-concentration photovoltaic cell module subjected to coupled thermal and power cycling test conditions

Kuo-Ning Chiang, Shih-Ying Chiang, Hwen-Fen Hong, 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Reliability assessment for solders with a stress buffer layer using ball shear strength test and board-level finite element analysis

Kuo-Ning Chiang, Chan-Yen Chou, Ming-Chih Yew, 2007, Microelectron. Reliab..

Thermal resistance analysis and validation of flip chip PBGA packages

Kuo-Ning Chiang, Kuo-Ming Chen, Kuo-Hsiung Houng, 2006, Microelectron. Reliab..

Reliability Analysis of a Package-on-Package Structure using the Novel WLCSP Technology with Fan-Out Capability

Hsiu-Ping Wei, Kuo-Ning Chiang, Ming-Chih Yew, 2006, 2006 International Conference on Electronic Materials and Packaging.

Reliability of interfacial adhesion in a multi-level copper/low-k interconnect structure

Kuo-Ning Chiang, Chang-Chun Lee, Chin-Chiu Hsia, 2007, Microelectron. Reliab..

The mechanical stress resistance capability of stress buffer structures in analog devices

Hsiao-Tung Ku, Kuo-Ning Chiang, 2008, Microelectron. Reliab..

Double-Layers Wafer Level Chip Scale Package (DL-WLCSP) solder joint shape prediction, reliability and parametric study

Kuo-Ning Chiang, Yung-Yu Hsu, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).