Mizuho Maki

4H-SiC Full Wafer Mapping Image of CMP-Finished Sub-Surface Damage by Laser Light Scattering

T. Kaneko, Daichi Dojima, Daichi Dansako, 2023 .

Effect of Sub-Surface Damage Layer Removal by Sublimation Etching of 4H-SiC Bulk Wafers on PL Imaging of Crystal Defect Visibility

T. Kaneko, Daichi Dojima, Daichi Dansako, 2023 .