Philippe Foubert

发表

Resist profile control in immersion lithography using scatterometry measurements

Shaunee Cheng, Ivan Pollentier, Monique Ercken, 2004, SPIE Advanced Lithography.

Screening of second-generation high-index liquids

Eric Hendrickx, Philippe Foubert, Sergei Postnikov, 2007, SPIE Advanced Lithography.

PSCAR optimization to reduce EUV resist roughness with sensitization using Resist Formulation Optimizer (RFO)

Geert Vandenberghe, Hans-Jürgen Stock, Peter De Bisschop, 2019, Advanced Lithography.

Track processing optimizations for different EUV resist platforms: preparing for a NXE:3300 baseline process

Anne-Marie Goethals, Eric Hendrickx, Philippe Foubert, 2013, Advanced Lithography.

Photosensitized Chemically Amplified Resist (PSCAR) 2.0 for high-throughput and high-resolution EUV lithography: dual photosensitization of acid generation and quencher decomposition by flood exposure

Geert Vandenberghe, Hans-Jürgen Stock, Yasin Ekinci, 2017, Advanced Lithography.

EUV process establishment through litho and etch for N7 node

Ming Mao, Philippe Foubert, Minoru Kubota, 2016, SPIE Advanced Lithography.

Mask-induced polarization effects at high NA

Bruce W. Smith, Philippe Foubert, Anatoly Bourov, 2005, SPIE Advanced Lithography.

Measurement and evaluation of water uptake by resists, top coats, stacks, and correlation with watermark defects

Monique Ercken, Philippe Foubert, Roel Gronheid, 2007, SPIE Advanced Lithography.

CLEAN TRACK solutions for defectivity and CD control towards 5 nm and smaller nodes

Satoru Shimura, Philippe Foubert, Kathleen Nafus, 2020, Advanced Lithography.

Analyzing block placement errors in SADP patterning

Carlos Fonseca, Satoru Shimura, Shinji Kobayashi, 2016, SPIE Advanced Lithography.

EUV patterning improvement toward high-volume manufacturing

Anne-Marie Goethals, Philippe Foubert, Kathleen Nafus, 2015, Advanced Lithography.

Exploring the readiness of EUV photo materials for patterning advanced technology nodes

Geert Vandenberghe, Danilo De Simone, Ming Mao, 2017, Advanced Lithography.

Progress in EUV lithography towards manufacturing from an exposure tool perspective

David Laidler, Eric Hendrickx, Philippe Foubert, 2012, Advanced Lithography.

New coater/developer technologies for CD control and defectivity reduction towards 5 nm and smaller nodes

Philippe Foubert, Kathleen Nafus, Shinichiro Kawakami, 2019, Photomask Technology.

Improvement of CD stability and defectivity in resist coating and developing process in EUV lithography process

Philippe Foubert, Kathleen Nafus, Shinichiro Kawakami, 2018, Photomask Technology.

Process window discovery, expansion and control of design hotspots susceptible to overlay failures

Philippe Foubert, Kaushik Sah, Andrew Cross, 2017, 2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO).

Calibrated PSCAR stochastic simulation

Geert Vandenberghe, Hans-Jürgen Stock, Peter De Bisschop, 2019, Advanced Lithography.

Manufacturability improvements in EUV resist processing toward NXE:3300 processing

Anne-Marie Goethals, Satoru Shimura, Philippe Foubert, 2014, Advanced Lithography.

Process for decamouflage an object

Philippe Foubert, Marc Bousquet, Nicolas Roux, 2015 .

High-volume manufacturing compatible dry development rinse process (DDRP): patterning and defectivity performance for EUVL

Geert Vandenberghe, Danilo De Simone, Philippe Foubert, 2017, Advanced Lithography.

Defectivity reduction by optimization of 193-nm immersion lithography using an interfaced exposure-track system

Philippe Foubert, Youri van Dommelen, Kathleen Nafus, 2006, SPIE Advanced Lithography.

Roughness characterization in the frequency domain and LWR mitigation with post-litho processes

Philippe Foubert, Roel Gronheid, Alessandro Vaglio-Pret, 2010, Advanced Lithography.

Technology for defectivity improvement in resist coating and developing process in EUV lithography process

Philippe Foubert, Kathleen Nafus, Shinichiro Kawakami, 2017, Photomask Technology.

Technology for defectivity improvement in resist coating and developing process in EUV lithography process

Philippe Foubert, Kathleen Nafus, Shinichiro Kawakami, 2017, Advanced Lithography.

Impact of post-litho LWR smoothing processes on the post-etch patterning result

Alessandro Vaglio Pret, Philippe Foubert, Efrain Altamirano Sanchez, 2011, Advanced Lithography.

Novel technologies in coater/developer to enhance the CD stability and to improve the defectivity toward N7 and smaller nodes

Makoto Muramatsu, Philippe Foubert, Kathleen Nafus, 2019, Advanced Lithography.

Process window discovery methodology development for advanced lithography

Philippe Foubert, Kaushik Sah, Andrew Cross, 2016, 2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).

EUV reticle print verification with advanced broadband optical wafer inspection and e-Beam review systems

Danilo De Simone, Philippe Foubert, Vidyasagar Anantha, 2017, Photomask Technology.

Resist coating and developing process technology toward EUV manufacturing sub 7nm node

Philippe Foubert, Kathleen Nafus, Shinichiro Kawakami, 2018, 2018 International Symposium on Semiconductor Manufacturing (ISSM).

Immersion specific defect mechanisms: findings and recommendations for their control

Frieda Van Roey, Mireille Maenhoudt, Monique Ercken, 2006, SPIE Advanced Lithography.

A CDU comparison of double patterning process options using Monte Carlo simulation

Shaunee Cheng, Philippe Foubert, Kathleen Nafus, 2009, Advanced Lithography.

Process window discovery, expansion and control of design hotspots susceptible to overlay failures

Philippe Foubert, Kaushik Sah, Andrew Cross, 2017, ASMC 2017.

Continuous improvements of defectivity rates in immersion photolithography via functionalized membranes in point-of-use photochemical filtration

Philippe Foubert, Lucia D'Urzo, Jelle Vandereyken, 2017, Advanced Lithography.

Patterning development in spin-on hard mask systems for 30nm half-pitch EUV technology

Christopher J. Wilson, Ivan Pollentier, Monique Ercken, 2012, Other Conferences.

Addressing EUV patterning challenges towards the limits of NA 0.33 EUV exposure

Makoto Muramatsu, Satoru Shimura, Philippe Foubert, 2021, International Conference on Extreme Ultraviolet Lithography 2021.

High performance filtration for bulk materials: a novel HDPE membrane filter designed for EUV lithography

Philippe Foubert, Lucia D'Urzo, Toru Umeda, 2021, Advanced Lithography.

Advances in defect performance in metal oxide photoresists for EUV lithography

Geert Vandenberghe, Amrit Narasimhan, Peter De Schepper, 2021 .

EUV resist performance enhancement by UV flood exposure for high NA EUV lithography

Geert Vandenberghe, Makoto Muramatsu, Danilo De Simone, 2021, Advanced Lithography.

Novel processing technologies for advanced EUV patterning materials using metal oxide resist (MOR)

Satoru Shimura, Danilo De Simone, Philippe Foubert, 2021, Advanced Lithography.

Roughness characterization in the frequency domain and linewidth roughness mitigation with post-lithography processes

Philippe Foubert, Roel Gronheid, Alessandro Vaglio Pret, 2010 .

EUV Resist Process Performance Investigations on the NXE3100 Full Field Scanner

Anne-Marie Goethals, Ardavan Niroomand, Ivan Pollentier, 2012 .

Influence of the Deposition Method on the Topography and Spectroscopy of J-Aggregates of a Thiacarbocyanine Dye Adsorbed to a Langmuir Film

Philippe Foubert, Mark Van der Auweraer, Roel Gronheid, 2002 .

PI3Kγ is a molecular switch that controls immune suppression

Philippe Foubert, Kelly A. Frazer, Hongying Li, 2016, Nature.

Impact of post-litho linewidth roughness smoothing processes on the post-etch patterning result

Philippe Foubert, Roel Gronheid, Alessandro Vaglio Pret, 2011 .

Imec's defect reduction strategies for EUV single exposed 32nm pitch line and space patterns (Conference Presentation)

Philippe Foubert, Paulina Rincon, 2019, International Conference on Extreme Ultraviolet Lithography 2019.