R. Sturdivant

Transitions and interconnects using coplanar waveguide and other three conductor transmission lines

R. Sturdivant, C. Quan, J. Wooldridge, 1996, 1996 IEEE MTT-S International Microwave Symposium Digest.

Design and performance of a high density 3D microwave module

M. Hauhe, R. Sturdivant, Chung Ly, 1997, 1997 IEEE MTT-S International Microwave Symposium Digest.

Reducing the effects of the mounting substrate on the performance of GaAs MMIC flip chips

R. Sturdivant, 1995, Proceedings of 1995 IEEE MTT-S International Microwave Symposium.