Gad Greenberg

AWV: high-throughput cross-array cross-wafer variation mapping

Jeong-Ho Yeo, Byoung-Ho Lee, Tae-Yong Lee, 2008, SPIE Advanced Lithography.

Process variation monitoring (PVM) by wafer inspection tool as a complementary method to CD-SEM for mapping LER and defect density on production wafers

Doron Meshulach, Shimon Levi, Kobi Kan, 2009, Advanced Lithography.