Naoya Saiki

Quantitative investigation of pick-up performance for UV-curable dicing tape

Takafumi Ogasawara, Naoya Saiki, Shinya Takyu, 2018, 2018 IEEE CPMT Symposium Japan (ICSJ).

A Novel Dicing tape for WLCSP Using Stealth Dicing Through Dicing tape and Back Side Protection-Film

Naoya Saiki, Kenta Furuno, Shigeyuki Yamashita, 2019 .

Application of spinal code for performance improvement in free-space optical communications

Eiji Okamoto, Morio Toyoshima, Hideki Takenaka, 2017, International Conference on Space Optics.

Study on Peeling Behavior in Pick-up Process of IC Chip with Adhesive Tapes

Kazuaki Inaba, Kikuo Kishimoto, Naoya Saiki, 2010 .

UV/heat dual‐curable adhesive tapes for fabricating stacked packages of semiconductors

Naoya Saiki, Osamu Yamazaki, Kazuyoshi Ebe, 2008 .