Yeong K. Kim

Analyses on the large size PBGA packaging reliability under random vibrations for space applications

Yeong K. Kim, Seok-min Lee, Do-Soon Hwang, 2020 .

PBGA packaging reliability assessments under random vibrations for space applications

Yeong K. Kim, Do Soon Hwang, Yeong-Kook Kim, 2015, Microelectron. Reliab..

Analyses on a directly attached airbag sensor packaging system

Yeong K. Kim, Hyun Jin Kang, Jong Dae Lee, 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Robust Design Optimization of Ball Grid Array Packaging

Yeong K. Kim, Jae Chang Kim, Joo-Ho Choi, 2011, DAC 2011.

Warpage mechanism analyses of strip panel type PBGA chip packaging

Jooho Choi, Yeong K. Kim, In Soo Park, 2010, Microelectron. Reliab..

Signal analyses of airbag sensor by side impact

Yeong K. Kim, Sojin Shin, 2017, 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition.

Finite element simulation of package stress in transfer molded MEMS pressure sensors

Yeong K. Kim, Rudolf Krondorfer, Jaeok Kim, 2004, Microelectron. Reliab..

Directly attached airbag sensor packaging for automobiles

Yeong K. Kim, Hyunjin Kang, Joon Ki Kim, 2016, 2016 Pan Pacific Microelectronics Symposium (Pan Pacific).

Distributed photoacoustic system for cure monitoring of composites

Isaac M Daniel, Yeong K. Kim, Jan Drewes Achenbach, 2001, SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring.

Module packaging effects on MEMS airbag sensor performance for automobiles

Yeong K. Kim, Sojin Shin, Dong Hyun Park, 2017, Microelectron. Reliab..

Material property effects on solder failure analyses

Yeong K. Kim, Bo-Young Lee, Jin Hyuk Gang, 2011, Microelectron. Reliab..