M. Shqair

Microstructural evolution during the crack propagation at the bond-wire contact area of IGBT power modules upon power cycling

Z. Khatir, M. Berkani, A. Ibrahim, 2022, Microelectronics Reliability.

An EBSD Study of Fatigue Crack Propagation in Bonded Aluminum Wires Cycled from 55°C to 85°C

Z. Khatir, A. Ibrahim, P. Pichón, 2022, Journal of Electronic Materials.