S. W. Kim

Full Integration and Characterization of L -ocalized Ox for Embedded Flash Technology -

M. K. Seo, S. W. Kim, S. H. Hwang, 2004 .

Formation of TSV for the stacking of advanced logic devices utilizing bumpless wafer-on-wafer technology

Takayuki Ohba, S. W. Kim, Hideki Kitada, 2012 .