T. Ninomiya

Conductive Filament Scaling of ${\rm TaO}_{\rm x}$ Bipolar ReRAM for Improving Data Retention Under Low Operation Current

T. Takagi, Takeki Ninomiya, S. Muraoka, 2013, IEEE Transactions on Electron Devices.

Demonstration of high-density ReRAM ensuring 10-year retention at 85°C based on a newly developed reliability model

Z. Wei, T. Takagi, Y. Kanzawa, 2011, 2011 International Electron Devices Meeting.

Highly reliable TaOx ReRAM and direct evidence of redox reaction mechanism

Z. Wei, T. Takagi, Y. Kanzawa, 2008, 2008 IEEE International Electron Devices Meeting.

Improvement of Data Retention During Long-Term Use by Suppressing Conductive Filament Expansion in ${\rm TaO}_{x}$ Bipolar-ReRAM

T. Takagi, Takeki Ninomiya, S. Muraoka, 2013, IEEE Electron Device Letters.

Conductive filament scaling of TaOx bipolar ReRAM for long retention with low current operation

Z. Wei, T. Takagi, Takeki Ninomiya, 2012, 2012 Symposium on VLSI Technology (VLSIT).