Junjian He

Low Temperature Bonding by Infiltrating Sn3.5Ag Solder into Porous Ag Sheet for High Temperature Die Attachment in Power Device Packaging

Mingyu Li, C. Hang, Hongtao Chen, 2018, Scientific Reports.

Low Temperature Bonding by Infiltrating Sn3.5Ag Solder into Porous Ag Sheet for High Temperature Die Attachment in Power Device Packaging

Mingyu Li, C. Hang, Hongtao Chen, 2018, Scientific Reports.

Effect of Solvent Properties on the Swelling Assisted with Protrusion of PS@TiO2

Junhui He, L. Zheng, Qinhui Chen, 2014 .