Alan Huffman

Novel optical-waveguide sensing platform based on input grating coupler

Sonia Grego, Christopher A. Bower, Brian R. Stoner, 2006, SPIE OPTO.

Fabrication of TSV-based silicon interposers

Dorota Temple, Christopher Gregory, Scott H. Goodwin, 2010, 2010 IEEE International 3D Systems Integration Conference (3DIC).

High density interconnect bonding of heterogeneous materials using non-collapsible microbumps at 10 μm pitch

Dorota Temple, John M. Lannon, Christopher Gregory, 2013, 2013 IEEE International 3D Systems Integration Conference (3DIC).

Recent advances in high density area array interconnect bonding for 3D integration

Dorota Temple, William B. Knowlton, Chris Gregory, 2010, Defense + Commercial Sensing.

Wafer-level 3D integration with 5 micron interconnect pitch for infrared imaging applications

Chris Gregory, Dorota Temple, John Lannon, 2014, Sensing Technologies + Applications.

Process characterisation of DuPont MXA140 dry film for high resolution microbump application

A. Huffman, Alan Huffman, Werner Liebsch, 2009, 2009 European Microelectronics and Packaging Conference.

Fabrication and Testing of a TSV-Enabled Si Interposer With Cu- and Polymer-Based Multilevel Metallization

Dorota Temple, Allan Hilton, John Lannon, 2014, IEEE Transactions on Components, Packaging and Manufacturing Technology.

High resolution acoustical imaging of high-density-interconnects for 3D-integration

John M. Lannon, Chris Gregory, Matthias Petzold, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

TSV-Last, Heterogeneous 3D Integration of a SiGe BiCMOS Beamformer and Patch Antenna for a W-Band Phased array Radar

Christopher Hillman, Parrish Ralston, Dean Malta, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

High density interconnect at 10µm pitch with mechanically keyed Cu/Sn-Cu and Cu-Cu bonding for 3-D integration

Dorota Temple, John M. Lannon, Chris Gregory, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Fabrication and characterization of metal-to-metal interconnect structures for 3-D integration

Dorota Temple, John M. Lannon, Matthew Lueck, 2009 .