A. Shimoyama

Power cycle reliability of SiC devices with metal-sinter die-attach and thermostable molding

K. Suganuma, Hao Zhang, S. Nagao, 2017 .

Thermal reliability of SiC device with Cu sintering die-attach processed at 250°C in N2 gas

K. Suganuma, Hao Zhang, S. Nagao, 2017 .

High temperature SiC power device realized by electroless plating diffusion barrier for Ag sinter die-attach

K. Suganuma, T. Sugahara, S. Nagao, 2017, 2017 International Conference on Electronics Packaging (ICEP).

Thermostable electroless plating optimized for Ag sinter die-attach realizing high TJ device packaging

K. Suganuma, H. Fujita, T. Sugahara, 2016, 2016 6th Electronic System-Integration Technology Conference (ESTC).