Chin C. Lee

Atomistic Insights into Silver-indium Solid Solution Softening Mechanism for Microelectronics Packaging

Xiuchen Zhao, Z. Qu, Yongjun Huo, 2023, Journal of Materials Research and Technology.

A Phase-field Model of Electrochemical Migration for Silver-based Conductive Adhesives

Yongjun Huo, Donglin Zhang, Chin C. Lee, 2023, Electrochimica Acta.