Myeongin Kim

发表

Laser Soldering Process Optimization of MEMS Probe of Probe Card for Semiconductor Wafer Test

W. Hong, Mi-Song Kim, Myeongin Kim, 2022, Journal of Welding and Joining.

Flip Chip - Chip Scale Package Bonding Technology with Type 7 Solder Paste Printing

W. Hong, Mi-Song Kim, Myeongin Kim, 2021, Journal of Welding and Joining.