Shang-Tsai Wu

Nonlinear analyses of semi-embedded through-silicon via (TSV) interposer with stress relief gap under thermal operating and environmental conditions

J. Lau, H. Chien, Shang-Tsai Wu, 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Thin-Wafer Handling with a Heat-Spreader Wafer for 2.5D/3D IC Integration

M. Kao, W. Lo, J. Lau, 2013 .

Assembly process and reliability assessment of TSV/RDL/IPD interposer with multi-chip-stacking for 3D IC integration SiP

Kuo-Shu Kao, Heng-Chieh Chien, J. H. Lau, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Thermal-mechanical responses of 3D IC integration with a passive TSV interposer

J. Lau, H. Chien, Shang-Tsai Wu, 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.