Jiang Xia
发表
Bin Li,
Guoyuan Li,
Jiang Xia,
2017,
Microelectron. Reliab..
Optimal Design for Vibration Reliability of Package-on-Package Assembly Using FEA and Taguchi Method
Bin Li,
Jiang Xia,
LanXian Cheng,
2016,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Jiang Xia,
2006
.
Lin Yang,
Qunxing Liu,
Qi Peng,
2019,
Microelectronics Reliability.
Xie Tao,
Yang Bing,
Wang Lianhui,
2016
.
Jiang Xia,
2007
.
Bin Li,
Bin Zhou,
Jiang Xia,
2017,
Microelectron. Reliab..
Jiang Xia,
2008
.
Jiang Xia,
J. Xia,
2009
.
Bin Zhou,
Jiang Xia,
LanXian Cheng,
2016,
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
Bin Zhou,
Jiang Xia,
GuoYuan Li,
2016,
2016 17th International Conference on Electronic Packaging Technology (ICEPT).