F. Voiron

Reducing substrate noise coupling in a 3D-PICS integrated passive device by localized P+ guard rings

Philippe Descamps, Daniel Pasquet, Miled Ben Salah, 2013 .

TSV development, characterization and modeling for 2.5-D interposer applications

F. Voiron, C. Bunel, J.-R Tenailleau, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Integrated Passive Devices and TSV, a disruptive technology for miniaturization

F. Voiron, S. Borel, C. Bunel, 2013 .

Towards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integration

F. Krismer, B. Michel, J. Kolar, 2017, 2017 IEEE International Electron Devices Meeting (IEDM).