David Geiger

X-ray inspection methods for controlling PCBA potting process — 2DX and partial angle computer tomography

Andy Liu, ChengYong Zou, Tianhui Lin, 2016, 2016 Pan Pacific Microelectronics Symposium (Pan Pacific).

A new drop test vehicle for a uniform shock response

Dongkai Shangguan, Dongji Xie, David Geiger, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Failure mechanism and mitigation of PCB pad cratering

Dongkai Shangguan, Dongji Xie, Boyi Wu, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Head in pillow (HIP) and yield study on SIP and PoP assembly

Dongkai Shangguan, Dongji Xie, David Geiger, 2009, 2009 59th Electronic Components and Technology Conference.

Reliability study of high-end Pb-free CBGA solder joint under various thermal cycling test conditions

Dongji Xie, Vadim Gektin, David Geiger, 2009, 2009 59th Electronic Components and Technology Conference.

Characterization of Solder Defects in Package on Packages with AXI Systems for Inspection Quality Improvement

David Geiger, Murad Kurwa, Weifeng Liu, 2015 .

PCB design optimization of 0201 packages

Fredrik Mattsson, David Geiger, Dongkai Shangguan, 2002 .