R. Bornoff
发表
M. Rencz,
A. Poppe,
G. Martin,
2017,
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
I. Belov,
P. Leisner,
R. Bornoff,
2007,
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.
A. Poppe,
R. Bornoff,
C. Marty,
2018,
2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
J. Parry,
R. Bornoff,
B. Blackmore,
2012,
2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).
V. d'Alessandro,
A. Magnani,
L. Codecasa,
2016,
2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM).
R. Bornoff,
A. Poppe,
M. Rencz,
2018,
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
R. Bornoff,
A. Vass-Varnai,
2013,
29th IEEE Semiconductor Thermal Measurement and Management Symposium.