P. Garrou

发表

Mitchell G. Dibbs, R. Picard, J. Wagner, 1998 .

Pre-develop bake for end point stabilization with photo-BCB polymers

Scott L. Cummings, P. Garrou, D. M. Scheck, 1998, Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153).

Underfill adhesion to BCB (Cyclotene/sup TM/) bumping and redistribution dielectrics

P. Garrou, Greg Meyers, Jang-Hi Im, 2000 .

Polymer dielectrics for multichip module packaging

P. Garrou, 1992 .

Thermosonic Gold Wirebonding to Electrolessly-Metallized Copper Bondpads over Benzocyclobutene

Richard Ulrich, P. Garrou, Jang-Hi Im, 1999 .