J. W. Wan

Influence of transient flow and solder bump resistance on underfill process

Wenjun Chris Zhang, J. W. Wan, D. J. Bergstrom, 2005, Microelectron. J..

Experimental verification of models for underfill flow driven by capillary forces in flip-chip packaging

Wenjun Chris Zhang, J. W. Wan, D. J. Bergstrom, 2008, Microelectron. Reliab..

Influence of the position of supply and exhaust openings on comfort in a passenger vehicle

J. W. Wan, J. van der Kooi, 2014 .

A Theoretical Analysis of the Concept of Critical Clearance Toward a Design Methodology for the Flip-Chip Package

W. J. Zhang, J. W. Wan, D. J. Bergstrom, 2007 .

Energy-efficient operation of two-pipe fan-coil unit system with independent fresh air supply

W. M. Zhang, J. W. Wan, 2009 .

An energy-efficient air-conditioning system with an exhaust fan integrated with a supply fan

W. J. Zhang, W. M. Zhang, J. W. Wan, 2009 .

Effect of outdoor air parameters on energy consumption with heat-pipe used in air-handling unit

J. W. Wan, J. L. Zhang, Kunli Yang, 2008 .

The effect of heat-pipe air-handling coil on energy consumption in central air-conditioning system

W. M. Zhang, J. W. Wan, J. Wan, 2007 .