E.B. Liao
发表
A.A.O. Tay,
V. Kripesh,
S.S. Ang,
2006,
IEEE Transactions on Advanced Packaging.
Xiaowu Zhang,
V. Kripesh,
N. Khan,
2010,
IEEE Transactions on Components and Packaging Technologies.
E.B. Liao,
N. Balasubramanian,
L.H. Guo,
2005,
IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest..
E.B. Liao,
N. Balasubramanian,
M. Tang,
2008,
2008 58th Electronic Components and Technology Conference.
R. Kumar,
E.B. Liao,
N. Balasubramanian,
2005,
IEEE Electron Device Letters.
K.F. Yang,
T.J. Wu,
W.C. Chiou,
2011,
2011 Symposium on VLSI Technology - Digest of Technical Papers.
V. Kripesh,
E.B. Liao,
Y.Y. Ong,
2007,
2007 9th Electronics Packaging Technology Conference.
V. Kripesh,
N. Khan,
E.B. Liao,
2008,
2008 58th Electronic Components and Technology Conference.
V. Kripesh,
E.B. Liao,
Y.Y. Ong,
2006,
2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium.
E.B. Liao,
N. Balasubramanian,
L.H. Guo,
2008,
IEEE Transactions on Electron Devices.
Guo-Qiang Lo,
Dim-Lee Kwong,
R. Kumar,
2007,
IEEE Transactions on Electron Devices.
E.B. Liao,
N. Balasubramanian,
L.H. Guo,
2006,
IEEE Electron Device Letters.