V. Vuorinen

XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connects

Mervi Paulasto-Kröckel, M. Krause, G. Ross, 2017, Microelectron. Reliab..

Optimization of contact metallizations for reliable wafer level AuSn bonds

Antti Rautiainen, Mervi Paulasto-Kröckel, V. Vuorinen, 2016, Microelectron. Reliab..

Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests

Jue Li, Toni T. Mattila, Tomi Laurila, 2007, Microelectron. Reliab..

Implementation and analysis of dual antenna diversity reception using measured impulse responses in cdma2000 system

V. Vuorinen, J. Mattila, 2004, 2004 IEEE 59th Vehicular Technology Conference. VTC 2004-Spring (IEEE Cat. No.04CH37514).

Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn-Cu intermetallic compound layers

Tomi Laurila, V. Vuorinen, Jorma K. Kivilahti, 2009, Microelectron. Reliab..

Large-eddy simulation in a complex hill terrain enabled by a compact fractional step OpenFOAM® solver

V. Vuorinen, A. Chaudhari, J.-P. Keskinen, 2015, Adv. Eng. Softw..

Aerodynamic characterization of isothermal swirling flows in combustors

V. Vuorinen, F. Castro-Ruiz, R. Szasz, 2014 .

Modeling cycle-to-cycle variations in spark ignited combustion engines by scale-resolving simulations for different engine speeds

V. Vuorinen, K. Keskinen, S. Karimkashi, 2019, Applied Energy.

Analysis of viscous fluid flow in a pressure-swirl atomizer using large-eddy simulation

V. Vuorinen, V. Vuorinen, H. Kahila, 2019, International Journal of Multiphase Flow.