Cristina Torregiani

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology

Luca Benini, Federico Angiolini, Paresh Limaye, 2010, IEEE Journal of Solid-State Circuits.

Design issues and considerations for low-cost 3D TSV IC technology

Paresh Limaye, Bart Vandevelde, Eric Beyne, 2010, 2010 IEEE International Solid-State Circuits Conference - (ISSCC).

Fine grain thermal modeling and experimental validation of 3D-ICs

Bart Vandevelde, Paul Marchal, Geert Van der Plas, 2011, Microelectron. J..

Compact thermal modeling of hot spots in advanced 3D-stacked structures

Bart Vandevelde, Eric Beyne, Ingrid De Wolf, 2009, EPTC 2009.