Vladimir Cherman
发表
Luca Benini,
Federico Angiolini,
Paresh Limaye,
2010,
IEEE Journal of Solid-State Circuits.
Eric Beyne,
Wei Guo,
Ingrid De Wolf,
2016,
IEEE Design & Test.
Houman Zahedmanesh,
Ingrid De Wolf,
Kris Vanstreels,
2015
.
Eric Beyne,
Geert Van der Plas,
Joeri De Vos,
2015,
2015 International Conference on IC Design & Technology (ICICDT).
Paresh Limaye,
Bart Vandevelde,
Eric Beyne,
2010,
2010 IEEE International Solid-State Circuits Conference - (ISSCC).
Bart Vandevelde,
Ingrid De Wolf,
Ann Witvrouw,
2012,
Microelectron. Reliab..
Mario Gonzalez,
Barbara Bonnet,
Vladimir Cherman,
2018,
2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).
Bart Vandevelde,
Eric Beyne,
Geert Van der Plas,
2012,
2012 IEEE International Conference on IC Design & Technology.
Eric Beyne,
Houman Zahedmanesh,
Luka Kljucar,
2018,
2018 IEEE International Reliability Physics Symposium (IRPS).
Diederik Verkest,
Bart Vandevelde,
Eric Beyne,
2012,
2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.
Bart Vandevelde,
Paul Marchal,
Geert Van der Plas,
2011,
Microelectron. J..
A. Khaled,
Ingrid De Wolf,
Ann Witvrouw,
2012,
Microelectron. Reliab..
Bart Vandevelde,
Eric Beyne,
Mario Gonzalez,
2013
.
Eric Beyne,
Mario Gonzalez,
Vladimir Cherman,
2018,
Microelectron. Reliab..
Bart Vandevelde,
C. S. Wong,
Ingrid De Wolf,
2016,
Microelectron. Reliab..
Comparative study of 3D stacked IC and 3D interposer integration: Processing and assembly challenges
Teng Wang,
Eric Beyne,
Geert Van der Plas,
2014,
2014 International 3D Systems Integration Conference (3DIC).
Paresh Limaye,
Deniz S. Tezcan,
Vladimir Cherman,
2010,
2010 12th Electronics Packaging Technology Conference.
Eric Beyne,
Geert Van der Plas,
Joeri De Vos,
2015
.
Eric Beyne,
Deniz S. Tezcan,
Philippe Soussan,
2011,
2011 IEEE International Interconnect Technology Conference.
Paresh Limaye,
Bart Vandevelde,
Eric Beyne,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Bart Vandevelde,
Eric Beyne,
Riet Labie,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Bart Vandevelde,
Riet Labie,
Kristof Croes,
2011,
2011 International Reliability Physics Symposium.
Eric Beyne,
Mario Gonzalez,
Vladimir Cherman,
2017,
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Mario Gonzalez,
Vladimir Cherman,
Melina Lofrano,
2016,
2016 6th Electronic System-Integration Technology Conference (ESTC).
Geert Van der Plas,
Mario Gonzalez,
Ingrid De Wolf,
2015
.