Muriel de Potter de ten Broeck

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology

Luca Benini, Federico Angiolini, Paresh Limaye, 2010, IEEE Journal of Solid-State Circuits.

Design issues and considerations for low-cost 3D TSV IC technology

Paresh Limaye, Bart Vandevelde, Eric Beyne, 2010, 2010 IEEE International Solid-State Circuits Conference - (ISSCC).

Active-lite interposer for 2.5 & 3D integration

Eric Beyne, Erik Jan Marinissen, Mirko Scholz, 2015, 2015 Symposium on VLSI Technology (VLSI Technology).

Ni silicide morphology on small features

Karen Maex, Jorge Kittl, Muriel de Potter de ten Broeck, 2004 .