Marc Nelis

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology

Luca Benini, Federico Angiolini, Paresh Limaye, 2010, IEEE Journal of Solid-State Circuits.

Design issues and considerations for low-cost 3D TSV IC technology

Paresh Limaye, Bart Vandevelde, Eric Beyne, 2010, 2010 IEEE International Solid-State Circuits Conference - (ISSCC).

Verifying thermal/thermo-mechanical behavior of a 3D stack — challenges and solutions

Paresh Limaye, Bart Vandevelde, Eric Beyne, 2010, Proceedings of 2010 International Symposium on VLSI Technology, System and Application.

Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions

Paresh Limaye, Bart Vandevelde, Eric Beyne, 2010, IEEE Custom Integrated Circuits Conference 2010.