J. Mueller

Integration of SiCN as a low /spl kappa/ etch stop and Cu passivation in a high performance Cu/low /spl kappa/ interconnect

Ertugrul Demircan, Larry Zhao, Steve Park, 2002, Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519).

JEDEC-Qualified Highly Reliable 22nm FD-SOI Embedded MRAM For Low-Power Industrial-Grade, and Extended Performance Towards Automotive-Grade-1 Applications

L. Y. Hau, J. W. Ting, Y. Otani, 2020, International Electron Devices Meeting.

Manufacturable 22nm FD-SOI Embedded MRAM Technology for Industrial-grade MCU and IOT Applications

L. Y. Hau, L. C. Goh, J. W. Ting, 2019, 2019 IEEE International Electron Devices Meeting (IEDM).