D. Engelhard

Characterization of asymmetries in 3D NAND memory devices

Bo Hui Ng, Shashank Srivastava, Jie Li, 2023, Advanced Lithography.

Ellipsometric critical dimension metrology employing mid-infrared wavelengths for high-aspect-ratio channel hole module etch processes

Nick Keller, Troy Ribaudo, Biow Hiem Ong, 2021, Advanced Lithography.