John W. Balde

发表

Workshop Report: Computer Packaging Workshop Explores Impact of LSI

John W. Balde, 1980, Computer.

Packaging Cost-Performance Computers

John W. Balde, 1988 .

Special Feature New Chip Carrier Package Concepts

John W. Balde, Daniel I. Amey, 1977, Computer.

Monterey Workshop on Computer Packaging

John W. Balde, J. Balde, 1981, Computer.

Workshop Report Computer Packaging

John W. Balde, 1976, Computer.

Computer Packaging Workshop Report: Interconnection Costs Will Be Dominant in the 80' s

John W. Balde, 1983, Computer.

Multichip Modules: Systems Advantages, Major Constructions, and Materials Technologies

R. Wayne Johnson, Robert K. F. Teng, John W. Balde, 1991 .

3-D ASSEMBLIES OF STACKED CHIPS AND OTHER THIN PACKAGES

John W. Balde, 2003 .

Foldable Flex and Thinned Silicon Multichip Packaging Technology

John W. Balde, J. Balde, 2003 .