P. Pieters

发表

Design-oriented measurement-based Scaleable models for multilayer MCM-D integrated passives, implementation in a design library offering automated layout

E. Beyne, Steven Brebels, Dominique Schreurs, 2000 .

Distributed microwave MCM-D circuits for X- and K-band applications

Steven Brebels, Eric Beyne, P. Pieters, 1999 .

Accurate measurement and characterisation of MCM-D integrated passives up to 50 GHz

Steven Brebels, Eric Beyne, Dominique Schreurs, 2000 .

Integrated passives for a DECT VCO

Eric Beyne, Kristof Vaesen, P. Pieters, 2000 .

MULTI-LAYER THIN-FILM MCM-D FOR THE INTEGRATION OF HIGH PERFORMANCE WIRELESS FRONT-END SYSTEMS

Eric Beyne, Bart Nauwelaers, Kristof Vaesen, 2001 .

Advances in microwave MCM-D technology

Eric Beyne, P. Pieters, Walter De Raedt, 2000 .

Chip-package co-design of a 5 GHz RF front-end for WLAN

E. Beyne, P. Wambacq, W. De Raedt, 2000, 2000 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.00CH37056).

Spiral inductors integrated in MCM-D using the design space concept

E. Beyne, P. Pieters, 1998, Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154).

Motion Compensation on Fast Crew Vessels: Concept Design and Technical Feasibility

P. Pieters, 2017 .

3DWaferLevelPackaging Approach TowardsCostEffective LowLossHighDensity 3DStacking

P. Pieters, Eric Beyne, 2006 .

Thin film tunnels versus air-bridges in coplanar waveguide discontinuities

E. Beyne, P. Pieters, E.A. Soliman, 1998, 1998 IEEE MTT-S International Microwave Symposium Digest (Cat. No.98CH36192).

High-Q Inductors for Realization of Low Insertion Loss Baluns and Couplers Integrated in Thin Film Multilayer MCM-D Technology for Wireless Applications

E. Beyne, S. Brebels, W. De Raedt, 2000, 2000 30th European Microwave Conference.

Analysis and design of two types of microwave baluns

Eric Beyne, P. Pieters, S. F. Mahmoud, 2000, ICM 2000. Proceedings of the 12th International Conference on Microelectronics. (IEEE Cat. No.00EX453).

Design of microwave MCM-D CPW quadrature couplers and power dividers in X-, Ku-, and Ka-band

Steven Brebels, Eric Beyne, P. Pieters, 2000 .

High-q spiral inductors for high performance integrated RF front-end sub-systems

Steven Brebels, Eric Beyne, G. Carchon, 2000 .

Suppression of the parasitic modes in CPW discontinuities using MCM-D technology-application to a novel 3-dB power splitter

Ezzeldin A. Soliman, Eric Beyne, Guy A. E. Vandenbosch, 1998 .

Integrated Wilkinson Power Dividers in C-, Ku- and Ka-Band in Multi-Layer Thin-Film MCM-D

S. Brebels, W. De Raedt, P. Pieters, 2000, 2000 30th European Microwave Conference.

Chip-package codesign of a low-power 5-GHz RF front end

E. Beyne, P. Wambacq, W. De Raedt, 2000, Proceedings of the IEEE.

Integrated antennas in MCM-D: examples and new possibilities for integrated systems

Ezzeldin A. Soliman, Steven Brebels, P. Pieters, 1999 .

Integration of passive components for microwave filters in MCM-D

E. Beyne, Steven Brebels, P. Pieters, 1997, Proceedings 1997 International Conference on Multichip Modules.

Modelling and characterisation of the polymer stud grid array (PSGA) package: electrical, thermal and thermo-mechanical qualification

E. Beyne, W. De Raedt, P. Pieters, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Wafer level packaging of micro/nanosystems

P. Pieters, 2005, 5th IEEE Conference on Nanotechnology, 2005..

Modeling and characterization of the polymer stud grid array (PSGA) package: electrical, thermal and thermo-mechanical qualification

Eric Beyne, Bart Nauwelaers, P. Pieters, 2003 .

Broadband coplanar couplers in multilayer thin film MCM-D technology

E. Beyne, S. Brebels, W. De Raedt, 1999, 1999 IEEE MTT-S International Microwave Symposium Digest (Cat. No.99CH36282).

Integration and Packaging MEMS Directly Above Active CMOS

A. Witvrouw, P. Pieters, D. Qi, 2007, 2007 International Symposium on High Density packaging and Microsystem Integration.

MCM-D technology for integrated passives components

E. Beyne, W. De Raedt, P. Pieters, 2000, ICM'99. Proceedings. Eleventh International Conference on Microelectronics (IEEE Cat. No.99EX388).

Accurate modeling of high-Q spiral inductors in thin-film multilayer technology for wireless telecommunication applications

Steven Brebels, Eric Beyne, Kristof Vaesen, 2001 .