A. Van den Eede

Process characterization of thin wafer debonding with thermoplastic materials

A. Jourdain, Andy Miller, G. Beyer, 2012, 2012 4th Electronic System-Integration Technology Conference.

Temporary wafer bonding defect impact assessment on substrate thinning: Process enhancement through systematic defect track down

E. Beyne, A. Jourdain, S. Suhard, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Evolution of temporary wafer (de)bonding technology towards low temperature processes for enhanced 3D integration

A. Jourdain, G. Beyer, E. Beyne, 2012, 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration.