Takehiro Kimura

System in wafer-level package technology with RDL-first process

Tomohiro Nishiyama, Masaya Kawano, Kazuyuki Mineo, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Fan-Out Wafer-Level Packaging with highly flexible design capabilities

Hiroaki Kobayashi, Masaya Kawano, Takehiro Kimura, 2010, 3rd Electronics System Integration Technology Conference ESTC.