J. Philipsen

Effect of plasma and staging time on the underfill voids in fine pitch flip-chip package

S. Wakeel, Dominic Koey Poh Meng, Stella Wong Wun Chin, 2021, International Conference on Electronic Packaging Technology.

Quantitative analysis of surface contaminants on silicon wafers by means of TOF-SIMS

P. Rostam-Khani, J. Philipsen, E. Jansen, 2006 .